miscellaneous printed board

Categories:
Categories:
Electronic Parts and Devices/Electronic Parts and Devices/printed circuit
Location:
JP - Japan
Reference year: 2000 - 2010
Description

This unit process represents the production/service of 1m2 of miscellaneous printed board ,in Japan created from statistical information and other sources.
This product includes Flexible Printed Wiring Board, Metal Core Printed Circuit Board . The system boundary of this process is "(industrial ceramics and industrial plastic product etc.) -> manufacturing -> packing."
Only substrates are classified into wiring boards.Those which have chips mounted are classified into circuit board.

Technology

The average production method in Japan in 2010 is assumed.

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Process type
Unit
Supported nomenclature
Other, ECOSPOLD2
LCI modeling approach
Attributional
Multifunctional modeling
CAUSAL
Format
Other
Aggregation type
UNKNOWN
Data provider
IDEA
Review status
Internal
Cost
For sale
License

Full unit process access.

Copyrighted
Yes
Copyright holder
AIST, JEMAI
Contact
support (at) idea-lca.jp