This unit process represents the production/service of 1P of treatment equipment for wafer process (electronic circuit forming) ,in Japan created from statistical information and other sources.
This product includes Annealing Device, Wet Etching Equipment, Electron Beam Exposure Apparatus, Wafer Heat Treatment Apparatus . The system boundary of this process is "(special steel stainless steel and plastic products for electric machinery and appliance etc.) -> processing/assembly."
Pure water production equipment are classified as <2678>.Design equipment is classified as <2829>.Testing equipment (electrical measuring instrument) is classified as <2751>.