Wafer slicing ; Multi-Si wafer ; Ingot breaker is used to slice the ingot

Categories:
Categories:
Unit processes/Materials production/Other materials
Location:
CN - China
Reference year: 2017 -
Description

Multi-Si When utilizing the life cycle inventory (LCI) data for the described process, users should ensure that they are applying this information within the context of photovoltaic module production, specifically for multi-crystalline silicon PV cells from 2011 to 2016 in China. It is important to account for technological changes over the time period and to consider geographical specificity when interpreting results. Careful attention should also be given to the boundaries of the study, ensuring that recycling processes, where applicable, are included, and that use-phase behavior of the PV systems, including energy output and degradation rates, is accurately modeled based on the available literature.

Technology

Ingot breaker is used to slice the ingot

Process type
Unit
LCI modeling approach
Attributional
Multifunctional modeling
NONE
Format
ILCD
Aggregation type
NOT_APPLICABLE
Data provider
TianGong
Review status
Internal
Cost
Free
Contact
Tiangong LCI Data Working Group